System-on-a-Package (SOP) substrate and module with digital, RF and optical integration

Venky Sundaram, Rao Tummala, George White, Kyutae Lim, Lixi Wan, Daniel Guidotti, Fuhan Liu, Swapan Bhattacharya, Raj M. Pulugurtha, Isaac Robin Abothu, Ravi Doraiswami, Raghuram V. Pucha, Joy Laskar, Manos Tentzeris, G. K. Chang, Madhavan Swaminathan

Research output: Contribution to journal › Conference article › peer-review

9 Scopus citations

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Engineering