TY - GEN
T1 - Tailoring the temperature coefficient of capacitance (TCC), dielectric loss and capacitance density with ceramic-polymer nanocomposites for RF applications
AU - Abothu, Isaac Robin
AU - Lee, Baik Woo
AU - Raj, P. Markondeya
AU - Engin, Ege
AU - Muthana, Prathap
AU - Yoon, Chong K.
AU - Swaminathan, Madhavan
AU - Tummala, Rao R.
N1 - Funding Information:
We thank the referees, G. Ghisellini and S. Covino, for their significant work that helped us improve this Letter. We thank D. Lazzati and E. Palazzi for discussions. D. B. acknowledges support from NSF grant AST 99-79812. J. K. was supported by Polish KBN grant 5P03D004-21. J. S. H. was supported by the Chandra Postdoctoral Fellowship Award PF0-10015 issued by the Chandra X-Ray Observatory Center, which is operated by the Smithsonian Astrophysical Observatory for and on behalf of NASA under contract NAS8-39073.
PY - 2006
Y1 - 2006
N2 - High-k inorganic materials generally show high loss or high TCC or both, making them unsuitable for RF capacitor applications where high Q, tolerance and thermal stability are critical. Most polymers do not have the required total set of attributes, making it extremely challenging to integrate high-performance RF thin film capacitors in organic packages and boards. In this paper, we demonstrate a strategy to tailor the properties of polymeric composite materials and satisfy all the RF capacitor requirements. With this strategy, it is feasible to meet low TCC and low loss while increasing the capacitance density or permittivity to miniaturize RF components.
AB - High-k inorganic materials generally show high loss or high TCC or both, making them unsuitable for RF capacitor applications where high Q, tolerance and thermal stability are critical. Most polymers do not have the required total set of attributes, making it extremely challenging to integrate high-performance RF thin film capacitors in organic packages and boards. In this paper, we demonstrate a strategy to tailor the properties of polymeric composite materials and satisfy all the RF capacitor requirements. With this strategy, it is feasible to meet low TCC and low loss while increasing the capacitance density or permittivity to miniaturize RF components.
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U2 - 10.1109/ECTC.2006.1645902
DO - 10.1109/ECTC.2006.1645902
M3 - Conference contribution
AN - SCOPUS:33845593975
SN - 1424401526
SN - 9781424401529
T3 - Proceedings - Electronic Components and Technology Conference
SP - 1790
EP - 1794
BT - Proceedings - IEEE 56th Electronic Components and Technology Conference
T2 - IEEE 56th Electronic Components and Technology Conference
Y2 - 30 May 2006 through 2 June 2006
ER -