TY - GEN
T1 - Temperature-aware power distribution network designs for 3D ICs and systems
AU - Park, Sung Joo
AU - Swaminathan, Madhavan
N1 - Publisher Copyright:
© 2015 IEEE.
PY - 2015/7/15
Y1 - 2015/7/15
N2 - Many recent problems related to integrated circuits have been solved by three-dimensional integration using throughsilicon vias. This technique presents some thermal-related issues related to high thermal density. In this work, we estimate the effects of temperature on power distribution networks consisting of a printed circuit board, an interposer, and stacked dies connected by through-silicon vias. The model we built has various on- and off-chip decoupling capacitors, so this paper analyzes the effects of temperature on power delivery network impedance and power ground noise using temperature-aware simulations. The results indicate that a high temperature density system requires both temperatureaware simulation and design. Based on further simulations with practical cases, this paper also presents an efficient power delivery network design method for three-dimensional systems consisting of various types of decoupling capacitors and heterogeneous dies.
AB - Many recent problems related to integrated circuits have been solved by three-dimensional integration using throughsilicon vias. This technique presents some thermal-related issues related to high thermal density. In this work, we estimate the effects of temperature on power distribution networks consisting of a printed circuit board, an interposer, and stacked dies connected by through-silicon vias. The model we built has various on- and off-chip decoupling capacitors, so this paper analyzes the effects of temperature on power delivery network impedance and power ground noise using temperature-aware simulations. The results indicate that a high temperature density system requires both temperatureaware simulation and design. Based on further simulations with practical cases, this paper also presents an efficient power delivery network design method for three-dimensional systems consisting of various types of decoupling capacitors and heterogeneous dies.
UR - https://www.scopus.com/pages/publications/84942100595
UR - https://www.scopus.com/pages/publications/84942100595#tab=citedBy
U2 - 10.1109/ECTC.2015.7159672
DO - 10.1109/ECTC.2015.7159672
M3 - Conference contribution
AN - SCOPUS:84942100595
T3 - Proceedings - Electronic Components and Technology Conference
SP - 732
EP - 737
BT - 2015 IEEE 65th Electronic Components and Technology Conference, ECTC 2015
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015
Y2 - 26 May 2015 through 29 May 2015
ER -