TY - JOUR
T1 - Temperature-Dependent Mechanochemical Wear of Silicon in Water
T2 - The Role of Si-OH Surfacial Groups
AU - Liu, Zhaohui
AU - Gong, Jian
AU - Xiao, Chen
AU - Shi, Pengfei
AU - Kim, Seong H.
AU - Chen, Lei
AU - Qian, Linmao
N1 - Funding Information:
The authors are grateful for the financial support from the National Natural Science Foundation of China (51875486) and Sichuan Science and Technology Program (2019YFH0098).
Publisher Copyright:
© 2019 American Chemical Society.
PY - 2019/6/18
Y1 - 2019/6/18
N2 - Mechanochemical wear has attracted much attention due to its critical role in micro/nanodevice applications, reliable microscopy, and ultraprecision manufacturing. As a process of stress-associated chemical reactions, mechanochemical wear strongly depends on temperature; however, the impact mechanism is not fully understood at any length scale. Here, we reported different water-temperature dependence of mechanochemical wear on two typical single crystal silicon (Si) surfaces, involving oxide-covered Si partially terminated with Si-OH groups and oxide-free Si fully terminated with Si-H groups. As the water temperature increased from 10 to 80 °C, the mechanochemical wear of the oxide-covered Si underwent a process from no obvious surface damage to significant material removal but that occurring at all temperatures decreased gradually on the oxide-free Si surface. The opposite temperature-dependence was found to have a strong relation to the growth or degeneration of the Si-OH surfacial groups. The mechanochemical wear on the both Si surfaces decreased with the Si-OH coverage rising, which facilitated the growth of strongly hydrogen-bonded ordered water and then suppressed the chemical reaction between the sliding interfaces. These results can provide new insight into the mechanism of the surrounding temperature affecting the reliable micro/nanodevices, manufacturing, and microscopy.
AB - Mechanochemical wear has attracted much attention due to its critical role in micro/nanodevice applications, reliable microscopy, and ultraprecision manufacturing. As a process of stress-associated chemical reactions, mechanochemical wear strongly depends on temperature; however, the impact mechanism is not fully understood at any length scale. Here, we reported different water-temperature dependence of mechanochemical wear on two typical single crystal silicon (Si) surfaces, involving oxide-covered Si partially terminated with Si-OH groups and oxide-free Si fully terminated with Si-H groups. As the water temperature increased from 10 to 80 °C, the mechanochemical wear of the oxide-covered Si underwent a process from no obvious surface damage to significant material removal but that occurring at all temperatures decreased gradually on the oxide-free Si surface. The opposite temperature-dependence was found to have a strong relation to the growth or degeneration of the Si-OH surfacial groups. The mechanochemical wear on the both Si surfaces decreased with the Si-OH coverage rising, which facilitated the growth of strongly hydrogen-bonded ordered water and then suppressed the chemical reaction between the sliding interfaces. These results can provide new insight into the mechanism of the surrounding temperature affecting the reliable micro/nanodevices, manufacturing, and microscopy.
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U2 - 10.1021/acs.langmuir.9b00790
DO - 10.1021/acs.langmuir.9b00790
M3 - Article
C2 - 31126172
AN - SCOPUS:85066976531
SN - 0743-7463
VL - 35
SP - 7735
EP - 7743
JO - Langmuir
JF - Langmuir
IS - 24
ER -