Terahertz Characterization of Glass-Based Materials and Stackups for 6 G Microelectronics Packaging

Min Zhai, Pragna Bhaskar, Haolian Shi, Madhavan Swaminathan, Alexandre Locquet, D. S. Citrin

Research output: Contribution to journalArticlepeer-review

2 Scopus citations

Abstract

Glass-based materials, including polymer/glass stack ups, are attractive structural blocks for packaging substrates supporting 5 G and 6 G microelectronic modules and components. We present the first broadband characterization of AGC Inc. EN-A1 alkali-free boroaluminosilicate glass and of Ajinomoto Build-up Film (ABF) laminated on soda-lime float glass substrate from 200 GHz to 2.5 THz with a commercial terahertz time-domain spectroscopy (THz-TDS) system. The refractive index n(ν) , attenuation coefficient α(ν) , permittivity ε(ν) , and loss tangent tan δ(ν) of EN-A1 glass as well as laminated ABF are nEN - A 1= 2.376 , αEN - A 1= 31.1 cm - 1 , εEN-A1′=5.64 , tan δEN - A 1= 0.062 , and nABF= 1.9 , αABF= 30 cm - 1 , εABF= 3.8 , tan δABF= 0.072 , all at 1 THz. Our results validate the promising perspective of both EN-A1 glass and ABF polymer materials as microwave and THz packaging solutions.

Original languageEnglish (US)
Pages (from-to)841-857
Number of pages17
JournalJournal of Infrared, Millimeter, and Terahertz Waves
Volume44
Issue number11-12
DOIs
StatePublished - Dec 2023

All Science Journal Classification (ASJC) codes

  • Radiation
  • Instrumentation
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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