Textural inhomogeneities in drawn and annealed OFHC copper wire

Textural inhomogeneities have been investigated in oxygen free high conducting (OFHC) copper wire drawn at room temperature to a true strain of 2.31, and isothermally annealed at 250°C and 750°C for annealing times ranging from 10 s to 1 hr. Local orientations were mapped by means of orientation imaging microscopy (OIM). The microtexture of the drawn wires showed a strong 〈111〉 + weak 〈100〉 duplex fiber texture at the inner core, whereas the mid and surface regions had a comparatively weak texture. Annealing at 250°C resulted into a recrystallization which originated from the mid section, proceed towards the surface regions and ends in the inner core. Recrystallization resulted into a strong〈100〉 +weak〈111〉 duplex fiber texture. A similar textural inhomogeneity was observed during short annealing at 750°C. However, prolonged annealing gave rise to abnormal grain-growth that proceed from the inner core to the outer surfaces with a dominant 〈111〉 fiber component at the inner region and mixed components of〈111〉, 〈100〉, and 〈112〉 at the outer surfaces.