The application of the solute sweeping model for grain boundary liquation during welding and sub-solidus annealing of an Al-Cu alloy

Research output: Contribution to journal › Article › peer-review

Original language	English (US)
Pages (from-to)	1113-1118
Number of pages	6
Journal	Materials Science Forum
Volume	331-337 II
DOIs	https://doi.org/10.4028/www.scientific.net/msf.331-337.1113
State	Published - 2000

All Science Journal Classification (ASJC) codes

@article{1a7c6e83b6894fbdb3191ad19e193d8d,

title = "The application of the solute sweeping model for grain boundary liquation during welding and sub-solidus annealing of an Al-Cu alloy",

author = "Wilson, \{Andre L.\} and Martukanitz, \{Richard P.\} and Howell, \{Paul R.\}",

year = "2000",

doi = "10.4028/www.scientific.net/msf.331-337.1113",

language = "English (US)",

volume = "331-337 II",

pages = "1113--1118",

journal = "Materials Science Forum",

issn = "0255-5476",

publisher = "Trans Tech Publications Ltd",

}

TY - JOUR

T1 - The application of the solute sweeping model for grain boundary liquation during welding and sub-solidus annealing of an Al-Cu alloy

AU - Wilson, Andre L.

AU - Martukanitz, Richard P.

AU - Howell, Paul R.

PY - 2000

Y1 - 2000

UR - https://www.scopus.com/pages/publications/17544367056

UR - https://www.scopus.com/pages/publications/17544367056#tab=citedBy

U2 - 10.4028/www.scientific.net/msf.331-337.1113

DO - 10.4028/www.scientific.net/msf.331-337.1113

M3 - Article

AN - SCOPUS:17544367056

SN - 0255-5476

VL - 331-337 II

SP - 1113

EP - 1118

JO - Materials Science Forum

JF - Materials Science Forum

ER -