The effect of nitric oxide anneals on silicon vacancies at and very near the interface of 4H SiC metal oxide semiconducting field effect transistors using electrically detected magnetic resonance

We use three electrically detected magnetic resonance (EDMR) approaches to explore nitric oxide (NO) annealing in 4H SiC metal-oxide-semiconductor field-effect transistors (MOSFETs). One approach is sensitive to defects at the interface and those extending into the SiC. Two of these approaches are particularly sensitive to SiC/SiO₂ interface defects. They show that NO anneals decrease the EDMR response. Since this and earlier studies indicate the ubiquitous presence of silicon vacancy centers in SiC MOSFETs, our results provide strong circumstantial evidence that these defects play an important role in limiting device performance and that NO anneals are effective in reducing their populations.