@inproceedings{ca3a7a73a0e446788277a2a646f67637,
title = "The effect of substrate temperature on the solidification of tin bonding wire via droplets jetting forming",
abstract = "The well-controlled droplets jetting forming permits high efficiency in bonding wire manufacture. In order to achieve better control of the droplets jetting forming, numerous parameters in the jetting process should be studied. This article study the effect of substrate temperature on the solidification of tin bonding wire. Experiments on the solidification of tin bonding wire under different substrate temperature have been conducted. Image of the bonding wire's surface have been captured using a CCD and a microscope. And the effect of substrate temperature on the solidification of tin bonding wire are discussed.",
author = "Dan Su and Chunxi Wang and Sheng Liu and Xiaotian Li and Honghai Zhang",
note = "Publisher Copyright: {\textcopyright} 2016 IEEE.; 17th International Conference on Electronic Packaging Technology, ICEPT 2016 ; Conference date: 16-08-2016 Through 19-08-2016",
year = "2016",
month = oct,
day = "4",
doi = "10.1109/ICEPT.2016.7583408",
language = "English (US)",
series = "2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1503--1507",
editor = "Keyun Bi and Sheng Liu and Shengjun Zhou",
booktitle = "2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016",
address = "United States",
}