TY - GEN
T1 - The influence of the thermal contact resistance on the thermal behavior of copper-carbon composites
AU - Neubauer, E.
AU - Smid, I.
AU - Chotikaprakhan, S.
AU - Dietzel, D.
AU - Bein, B. K.
AU - Korb, G.
PY - 2005/12/1
Y1 - 2005/12/1
N2 - Metal Matrix Composites (MMCs) based on copper with carbon fibers or carbon based reinforcements exhibit a high potential for applications as heat sink materials. From theoretical considerations the thermal properties can be tailored by a simple variation of the volume fraction of the reinforcement. An additional parameter of importance in the copper-carbon system is the thermal contact resistance (TCR). By avariation of the TCR the whole range between an insulating interface and a perfect heat transfer can be simulated in theoretical calculations. The realization of the desired experimental values for the TCR, however, is not an easy task. By using a simplified model system, consisting of a copper coating on a carbon substrate, a first attempt has been done to determine the experimental values of the TCR in this material combination by the help of photothermal methods.
AB - Metal Matrix Composites (MMCs) based on copper with carbon fibers or carbon based reinforcements exhibit a high potential for applications as heat sink materials. From theoretical considerations the thermal properties can be tailored by a simple variation of the volume fraction of the reinforcement. An additional parameter of importance in the copper-carbon system is the thermal contact resistance (TCR). By avariation of the TCR the whole range between an insulating interface and a perfect heat transfer can be simulated in theoretical calculations. The realization of the desired experimental values for the TCR, however, is not an easy task. By using a simplified model system, consisting of a copper coating on a carbon substrate, a first attempt has been done to determine the experimental values of the TCR in this material combination by the help of photothermal methods.
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M3 - Conference contribution
AN - SCOPUS:84883370986
SN - 0976205726
SN - 9780976205722
T3 - Advances in Powder Metallurgy and Particulate Materials - 2005, Proceedings of the 2005 International Conference on Powder Metallurgy and Particulate Materials, PowderMet 2005
SP - 16
EP - 26
BT - Advances in Powder Metallurgy and Particulate Materials - 2005, Proceedings of the 2005 International Conference on Powder Metallurgy and Particulate Materials, PowderMet 2005
T2 - 2005 International Conference on Powder Metallurgy and Particulate Materials, PowderMet 2005
Y2 - 19 June 2005 through 23 June 2005
ER -