Abstract
Laser profilometry measurements of fiber displacements during thin-slice fiber pushout tests of three MMC systems indicate that interfacial failure initiates at the specimen backface, opposite the indenter location. Backface failure initiation occurs at loads as low as 50% of the maximum "debond" load, even under test conditions designed to minimize specimen flexure under load. Finally, at least in the two sapphire-TiAl systems examined, there is evidence that the entire fiber displaces as a unit under increasing loads prior to the maximum debond load. The above failure sequence is consistent with recent analyses (9,15) which predict backface failure initiation in thin-slice MMC specimens in which large thermally induced residual stresses exist. The present data also suggest a difficulty in associating the maximum debond load, PMAX, solely with crack growth.
Original language | English (US) |
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Pages (from-to) | 543-549 |
Number of pages | 7 |
Journal | Scripta Materialia |
Volume | 35 |
Issue number | 4 |
DOIs | |
State | Published - Aug 15 1996 |
All Science Journal Classification (ASJC) codes
- General Materials Science
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering
- Metals and Alloys