The microstructure of epitaxial YBa2Cu3O7 films on steep steps in LaAlO3 substrates

  • C. L. Jia
  • , B. Kabius
  • , K. Urban
  • , K. Herrmann
  • , J. Schubert
  • , W. Zander
  • , A. I. Braginski

Research output: Contribution to journalArticlepeer-review

Abstract

The microstructure of YBa2Cu3O7 grown on steep steps in (001 pseudocubic LaAlO3 substrates was studied by high-resolution electron microscopy of cross-sectional and plan-view samples. Steps with angles of about 80° were obtained by ion milling. On the substrate plane, the films grew with the c-axis parallel to [001] while on the flank of a step the c-axis was parallel to the [100] direction of the substrate. As a result, two [010] tilt axis grain boundaries were formed at which the YBa2Cu3O7 lattice changed orientation by approximately 90°. In the upper grain boundary, a [100] tilt axis and, on the average, a (013) habit plane alternated with a [010] tilt axis and a (1 0 3) habit plane. This alternating structure was caused by twinning in the orthorhombic film structure. The lower grain boundaries were found to be rather irregular and consisted of a chain of (0 1 3)(0 1 3) and (0 1 0)(0 0 1) type segments exhibiting a tendency to tilt the whole habit plane toward the a-b plane of the flank film. Dislocations, stacking faults and misfit strains were also observed in or close to the boundaries. Grain boundary modeling indicated a good agreement with the experimental image and permitted us to determine the atomic plane of a boundary.

Original languageEnglish (US)
Pages (from-to)211-226
Number of pages16
JournalPhysica C: Superconductivity and its Applications
Volume196
Issue number3-4
DOIs
StatePublished - Jun 20 1992

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Energy Engineering and Power Technology
  • Electrical and Electronic Engineering

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