Abstract
This work presents a system of measuring grinding forces in precision applications. Several experiments demonstrate the performance in monitoring diamond wheel dressing, detecting workpiece contact, and process monitoring. The system appears promising for monitoring precision wafer grinding since this approach provides excellent sensitivity, high signal resolution, and good bandwidth.
Original language | English (US) |
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Title of host publication | Proceedings of the 21st Annual ASPE Meeting, ASPE 2006 |
State | Published - 2006 |
Event | 21st Annual Meeting of the American Society for Precision Engineering, ASPE 2006 - Monterey, CA, United States Duration: Oct 15 2006 → Oct 20 2006 |
Other
Other | 21st Annual Meeting of the American Society for Precision Engineering, ASPE 2006 |
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Country/Territory | United States |
City | Monterey, CA |
Period | 10/15/06 → 10/20/06 |
All Science Journal Classification (ASJC) codes
- Mechanical Engineering