Thermal-aware 3D IC designs

Xiaoxia Wu; Yuan Xie; Vijaykirshnan Narayanan

doi:10.4032/9789814303828

Thermal-aware 3D IC designs

Xiaoxia Wu, Yuan Xie, Vijaykirshnan Narayanan

Research output: Chapter in Book/Report/Conference proceeding › Chapter

2 Scopus citations

Abstract

Power and thermal issues have become the primary concerns in traditional 2D IC design. Although emerging 3D technology offers several benefits over 2D, the stacking of multiple active layers in 3D design leads to higher power densities than its 2D counterpart, exacerbating the thermal issue. Therefore, it is essential to conduct thermal-aware 3D IC designs. This chapter presents an overview of thermal modeling for 3D IC and outlines solution schemes to overcome the thermal challenges at Electrical Design Automation (EDA) and architectural levels.

Original language	English (US)
Title of host publication	3D Integration for VLSI Systems
Publisher	Pan Stanford Publishing Pte. Ltd.
Pages	313-334
Number of pages	22
ISBN (Print)	9789814303811
DOIs	https://doi.org/10.4032/9789814303828
State	Published - Sep 30 2011

All Science Journal Classification (ASJC) codes

General Engineering

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10.4032/9789814303828

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@inbook{598b9ebc8438425886b03c7fb8082e9b,

title = "Thermal-aware 3D IC designs",

abstract = "Power and thermal issues have become the primary concerns in traditional 2D IC design. Although emerging 3D technology offers several benefits over 2D, the stacking of multiple active layers in 3D design leads to higher power densities than its 2D counterpart, exacerbating the thermal issue. Therefore, it is essential to conduct thermal-aware 3D IC designs. This chapter presents an overview of thermal modeling for 3D IC and outlines solution schemes to overcome the thermal challenges at Electrical Design Automation (EDA) and architectural levels.",

author = "Xiaoxia Wu and Yuan Xie and Vijaykirshnan Narayanan",

year = "2011",

month = sep,

day = "30",

doi = "10.4032/9789814303828",

language = "English (US)",

isbn = "9789814303811",

pages = "313--334",

booktitle = "3D Integration for VLSI Systems",

publisher = "Pan Stanford Publishing Pte. Ltd.",

}

TY - CHAP

T1 - Thermal-aware 3D IC designs

AU - Wu, Xiaoxia

AU - Xie, Yuan

AU - Narayanan, Vijaykirshnan

PY - 2011/9/30

Y1 - 2011/9/30

N2 - Power and thermal issues have become the primary concerns in traditional 2D IC design. Although emerging 3D technology offers several benefits over 2D, the stacking of multiple active layers in 3D design leads to higher power densities than its 2D counterpart, exacerbating the thermal issue. Therefore, it is essential to conduct thermal-aware 3D IC designs. This chapter presents an overview of thermal modeling for 3D IC and outlines solution schemes to overcome the thermal challenges at Electrical Design Automation (EDA) and architectural levels.

AB - Power and thermal issues have become the primary concerns in traditional 2D IC design. Although emerging 3D technology offers several benefits over 2D, the stacking of multiple active layers in 3D design leads to higher power densities than its 2D counterpart, exacerbating the thermal issue. Therefore, it is essential to conduct thermal-aware 3D IC designs. This chapter presents an overview of thermal modeling for 3D IC and outlines solution schemes to overcome the thermal challenges at Electrical Design Automation (EDA) and architectural levels.

UR - http://www.scopus.com/inward/record.url?scp=84881679001&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84881679001&partnerID=8YFLogxK

U2 - 10.4032/9789814303828

DO - 10.4032/9789814303828

M3 - Chapter

AN - SCOPUS:84881679001

SN - 9789814303811

SP - 313

EP - 334

BT - 3D Integration for VLSI Systems

PB - Pan Stanford Publishing Pte. Ltd.

ER -

Thermal-aware 3D IC designs

Abstract

All Science Journal Classification (ASJC) codes

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