Thermal-aware reliability analysis for platform FPGAs

Keyphrases

• Thermal-aware 100%
• Reliability Management 66%
• Temperature Impact 33%
• Time-dependent Dielectric Breakdown 33%
• Dependent Failure 33%
• Hard Block 33%
• Temperature Measurement Method 33%
• Real-time Temperature Monitoring 33%
• Oscillator Basis 33%
• Hard Failure 33%

Engineering

• Reliability Analysis 100%
• Field Programmable Gate Arrays 100%
• Dielectrics 14%
• Power Density 14%
• Feature Size 14%
• Failure Mechanism 14%
• Performance Degradation 14%
• Negative-Bias Temperature Instability 14%
• Temperature Time 14%
• Electromigration 14%

Computer Science

• Management Framework 100%
• Performance Degradation 50%
• Field Programmable Gate Arrays 50%
• Ring Oscillator 50%