Thermal Conductivity of Aluminum Scandium Nitride for 5G Mobile Applications and beyond

Yiwen Song, Carlos Perez, Giovanni Esteves, James Spencer Lundh, Christopher B. Saltonstall, Thomas E. Beechem, Jung In Yang, Kevin Ferri, Joseph E. Brown, Zichen Tang, Jon Paul Maria, David W. Snyder, Roy H. Olsson, Benjamin A. Griffin, Susan E. Trolier-Mckinstry, Brian M. Foley, Sukwon Choi

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