Keyphrases
Alloying Effect
25%
AlN Film
25%
Aluminum Scandium Nitride (AlScN)
100%
C-axis
25%
Data Transmission Rate
25%
Film Bulk Acoustic Resonator
50%
Film Thickness Distribution
25%
Grain Density
50%
K(I)
25%
Less Power
25%
Limit Power
25%
Limited Power
25%
Low Insertion Loss
25%
Microstructure
25%
Order of Magnitude
25%
Piezoelectric Response
25%
Power Dissipated
25%
Power Handling
50%
Radio Frequency
25%
Radio Frequency Microelectromechanical Systems (RF MEMS)
50%
Reactive Sputter Deposition
25%
Resonator
25%
Resonator Structure
25%
Systems-based
25%
Thermal Conductivity
100%
Thermal Performance
25%
Thermal Transport
25%
Material Science
Alloying
25%
Aluminum
100%
Aluminum Nitride
50%
Bulk Film
50%
Density
50%
Film
100%
Film Thickness
25%
Microelectromechanical System
50%
Nitride Compound
100%
Piezoelectricity
25%
Resonator
75%
Scandium
100%
Sputter Deposition
25%
Thermal Conductivity
100%
Engineering
Alloying
25%
Data Transmission Rate
25%
Film Density
25%
Insertion Loss
25%
Microelectromechanical System
50%
Nitride
100%
Piezoelectric
25%
Power Limit
25%
Radio Frequency
75%
Resonator
75%
Thermal Conductivity
100%
Thermal Performance
25%