Thermal design and optimization methodology for integrated power electronics modules

Ying Feng Pang; Elaine P. Scott; Jonah Zhou Chen; Karen A. Thole

doi:10.1115/1.1849233

Thermal design and optimization methodology for integrated power electronics modules

Ying Feng Pang, Elaine P. Scott, Jonah Zhou Chen, Karen A. Thole

Mechanical Engineering

Research output: Contribution to journal › Article › peer-review

10 Scopus citations

Abstract

A methodology was developed and implemented to optimize the design layout for integrated power electronics modules (IPEMs) by considering both the electrical and thermal performances. This paper is primarily focused on the thermal aspects, which were analyzed using three-dimensional (3D) computational software tools. Implementation of the design methodology resulted in a 70 percent reduction in the common mode current, a 4 percent reduction in the size of the geometric footprint, and a 7°C reduction in the maximum temperature rise for the case studied, thus, providing an increase in the IPEM's overall performance

Original language	English (US)
Pages (from-to)	59-66
Number of pages	8
Journal	Journal of Electronic Packaging, Transactions of the ASME
Volume	127
Issue number	1
DOIs	https://doi.org/10.1115/1.1849233
State	Published - Mar 2005

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Mechanics of Materials
Computer Science Applications
Electrical and Electronic Engineering

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10.1115/1.1849233

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Thermal design and optimization methodology for integrated power electronics modules

Abstract

All Science Journal Classification (ASJC) codes

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