@inproceedings{b17012f64c0146519b45d6c8da959420,
title = "Thermal investigation of high-power photodiodes",
abstract = "The performance of high power photodiodes flip-chip bonded on multi-crystal aluminum nitride (AlN), single-crystal AlN, and diamond submounts are compared. The thermal boundary conductance of submount-Ti interfaces was measured and found to be the primary impedance to heat dissipation.",
author = "Yang Shen and John Gaskins and Xiaojun Xie and Foley, {Brian M.} and Ramez Cheaito and Hopkins, {Patrick E.} and Campbell, {Joe C.}",
note = "Publisher Copyright: {\textcopyright} 2017 IEEE.; 30th Annual Conference of the IEEE Photonics Society, IPC 2017 ; Conference date: 01-10-2017 Through 05-10-2017",
year = "2017",
month = nov,
day = "20",
doi = "10.1109/IPCon.2017.8116003",
language = "English (US)",
series = "30th Annual Conference of the IEEE Photonics Society, IPC 2017",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "53--54",
booktitle = "30th Annual Conference of the IEEE Photonics Society, IPC 2017",
address = "United States",
}