Thermal shock and fatigue behavior of ceramic tubes

A. E. Segall, Hellmann, R. E. Tressler

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations


A narrow circumferential helium quench was used to thermally shock and fatigue internally heated alumina, reaction bonded, and sintered alpha silicon carbide tubes at 500°C and 1000°C. During these tests, transient temperature measurements required for thermal and stress-profile calculations were obtained through the use of microthermocouples positioned along the internal surface of the tubes. Acoustic emissions were also employed for in situ monitoring of crack initiation and propagation of the resident flaw populations during the single and repeated (up to 5) thermal shocks. Post-quench inspections and destructive burst tests were used to correlate the existence, extent, and statistical (Weibull) nature of the damage induced by the cycling. Results indicated progressive strength degradation in alumina tubes with repeated thermal cycles. In contrast, the thermally-cycled silicon carbide samples either showed no damage at all, or suffered minimal progressive strength degradation after the first cycle. In any case, the complex stress distributions computed from an FEA-based inverse heat transfer analysis were required to understand the observed damage (crack paths) and apparent fatigue behavior.

Original languageEnglish (US)
Title of host publication10th Biennial Conference on Reliability, Stress Analysis, and Failure Prevention
PublisherAmerican Society of Mechanical Engineers (ASME)
Number of pages11
ISBN (Electronic)9780791811726
StatePublished - 1993
EventASME 1993 Design Technical Conferences, DETC 1993 - Albuquerque, United States
Duration: Sep 19 1993Sep 22 1993

Publication series

NameProceedings of the ASME Design Engineering Technical Conference
VolumePart F167972-4


ConferenceASME 1993 Design Technical Conferences, DETC 1993
Country/TerritoryUnited States

All Science Journal Classification (ASJC) codes

  • Mechanical Engineering
  • Computer Graphics and Computer-Aided Design
  • Computer Science Applications
  • Modeling and Simulation


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