Thermal stress accommodation in dip cast lead zirconate-titanate ferroelectric films on flexible substrates

Chemical Compounds

• Ferroelectric Film 93%
• Thermal Expansion 38%
• Ferroelectric Domain 31%
• Liquid Film 26%
• Residual Stress 24%
• Permittivity 20%
• Dielectric Property 18%
• Dielectric Material 15%
• Flexibility 14%
• Compound Mobility 13%
• Polarization 13%
• Resistance 11%
• X-Ray Diffraction 8%
• Metal 8%

Engineering & Materials Science

• Ferroelectric films 100%
• Lead zirconate titanate 65%
• Thermal stress 53%
• Substrates 38%
• Ferroelectric materials 13%
• Thermal expansion 10%
• Remanence 7%
• Compressive stress 5%
• Permittivity 4%
• Tensile stress 4%
• X ray diffraction 4%
• Thin films 4%
• Residual stresses 4%
• Coatings 3%
• Stiffness 3%
• Metals 3%