Abstract
Recently, multilayer ceramic capacitor (MLCC) manufacturers have focused on replacing costly noble-metal electrodes with base-metal electrodes (BME), which affects all stages of the fabrication process. Binder removal is a critical step in the process and must be controlled to avoid delamination and deleterious electrode oxidation. Thus, the deformation behavior of BME-multilayer ceramic capacitors (MLCCs) during binder burnout is characterized using thermomechanical analysis (TMA), and results are compared to thermogravimetric analysis (TGA) data.
| Original language | English (US) |
|---|---|
| Pages | 34-38 |
| Number of pages | 5 |
| Volume | 80 |
| No | 10 |
| Specialist publication | American Ceramic Society Bulletin |
| State | Published - Oct 1 2001 |
All Science Journal Classification (ASJC) codes
- Ceramics and Composites