Thermomechanical behavior of BME capacitors during binder burnout

Hyo Tae Kim; James H. Adair; Michael T. Lanagan

Thermomechanical behavior of BME capacitors during binder burnout

Research output: Contribution to specialist publication › Article

Abstract

Recently, multilayer ceramic capacitor (MLCC) manufacturers have focused on replacing costly noble-metal electrodes with base-metal electrodes (BME), which affects all stages of the fabrication process. Binder removal is a critical step in the process and must be controlled to avoid delamination and deleterious electrode oxidation. Thus, the deformation behavior of BME-multilayer ceramic capacitors (MLCCs) during binder burnout is characterized using thermomechanical analysis (TMA), and results are compared to thermogravimetric analysis (TGA) data.

Original language	English (US)
Pages	34-38
Number of pages	5
Volume	80
No	10
Specialist publication	American Ceramic Society Bulletin
State	Published - Oct 2001

All Science Journal Classification (ASJC) codes

Ceramics and Composites

Cite this

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title = "Thermomechanical behavior of BME capacitors during binder burnout",

abstract = "Recently, multilayer ceramic capacitor (MLCC) manufacturers have focused on replacing costly noble-metal electrodes with base-metal electrodes (BME), which affects all stages of the fabrication process. Binder removal is a critical step in the process and must be controlled to avoid delamination and deleterious electrode oxidation. Thus, the deformation behavior of BME-multilayer ceramic capacitors (MLCCs) during binder burnout is characterized using thermomechanical analysis (TMA), and results are compared to thermogravimetric analysis (TGA) data.",

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AU - Lanagan, Michael T.

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N2 - Recently, multilayer ceramic capacitor (MLCC) manufacturers have focused on replacing costly noble-metal electrodes with base-metal electrodes (BME), which affects all stages of the fabrication process. Binder removal is a critical step in the process and must be controlled to avoid delamination and deleterious electrode oxidation. Thus, the deformation behavior of BME-multilayer ceramic capacitors (MLCCs) during binder burnout is characterized using thermomechanical analysis (TMA), and results are compared to thermogravimetric analysis (TGA) data.

AB - Recently, multilayer ceramic capacitor (MLCC) manufacturers have focused on replacing costly noble-metal electrodes with base-metal electrodes (BME), which affects all stages of the fabrication process. Binder removal is a critical step in the process and must be controlled to avoid delamination and deleterious electrode oxidation. Thus, the deformation behavior of BME-multilayer ceramic capacitors (MLCCs) during binder burnout is characterized using thermomechanical analysis (TMA), and results are compared to thermogravimetric analysis (TGA) data.

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Thermomechanical behavior of BME capacitors during binder burnout

Abstract

All Science Journal Classification (ASJC) codes

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