Abstract
In this paper, we utilize micro-Raman spectroscopy to measure temperature and stress in state-of-the-art AlGaN/GaN HEMTs. A rigorous discussion on the physical accuracy, precision, and precautions for diverse Raman thermometry methods is developed. Thermometry techniques utilizing shifts in a single Raman Stokes peak position underpredict the channel temperature due to induction of operational thermoelastic stress in operating devices. Utilizing the change in phonon linewidth by employing a proper reference condition gives true temperature results. Making use of frequency shifts in both the E 2(high) and A1(LO) phonon modes offers accurate and time-efficient means to determine the state of temperature and thermal stress in operating AlGaN/GaN HEMTs presuming that linear relations between phonon frequencies and temperature/stress are well determined. Useful applications of this method such as monitoring stress in GaN wafers between fabrication steps and Raman thermography on AlGaN/GaN HEMTs are demonstrated.
Original language | English (US) |
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Article number | 6507260 |
Pages (from-to) | 1898-1904 |
Number of pages | 7 |
Journal | IEEE Transactions on Electron Devices |
Volume | 60 |
Issue number | 6 |
DOIs | |
State | Published - 2013 |
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering