THERMOPHYSICAL PROPERTY MEASUREMENT OF GAN-ON-ALN WAFERS FOR NEXT-GENERATION RF DEVICE TECHNOLOGIES

Husam Walwil, Daniel C. Shoemaker, Yiwen Song, Kyuhwe Kang, Nathaniel S. McIlwaine, Michael L. Schuette, James S. Tweedie, Scott T. Sheppard, Jon Paul Maria, Sukwon Choi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Gallium nitride (GaN) high electron mobility transistors (HEMTs) play a crucial role in modern radio frequency (RF) power amplifiers. However, the performance and reliability of GaN HEMTs are negatively impacted by device self-heating. Hence, it's imperative to thoroughly characterize the entire thermal resistance network within the material stack to pinpoint any bottleneck resistance components. In this study, a multi-frequency, multi-spot time-domain thermoreflectance measurement approach was used to measure the thermal resistance associated with the constituent layers and interfaces within a GaN-on-AlN wafer stack. The thermal conductivity of the GaN layer and the AlN substrate in both through-plane and in-plane directions were determined. The GaN/AlN interface exhibits a high thermal boundary conductance (TBC) of 500 MW/m2·K. This surpasses previously reported TBC values across GaN/SiC and GaN/diamond interfaces, highlighting the potential for improved thermal management of GaN HEMTs.

Original languageEnglish (US)
Title of host publicationProceedings of ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2024
PublisherAmerican Society of Mechanical Engineers
ISBN (Electronic)9780791888469
DOIs
StatePublished - 2024
EventASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2024 - San Jose, United States
Duration: Oct 8 2024Oct 10 2024

Publication series

NameProceedings of ASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2024

Conference

ConferenceASME 2024 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2024
Country/TerritoryUnited States
CitySan Jose
Period10/8/2410/10/24

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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