Keyphrases
Crack Initiation
100%
Crack Propagation
100%
Pb(Zr,Ti)O3
100%
Thickness Dependence
100%
Micro-electro-mechanical Systems
100%
Si Wafer
66%
SiO2 Layer
66%
Layer Thickness
33%
Device Performance
33%
Si Substrate
33%
Character Strengths
33%
Structural Integrity
33%
Piezoelectric Thin Film
33%
Varying Thickness
33%
Weibull Modulus
33%
Weibull Analysis
33%
Energy Criterion
33%
Structural Devices
33%
Fracture Process
33%
Piezoelectric Film
33%
Bending Test
33%
Linear Elastic Fracture Mechanics
33%
Stress Energy
33%
LaNiO3
33%
Biaxial Bending
33%
PiezoMEMS
33%
Engineering
Piezoelectric
100%
Crack Propagation
100%
Microelectromechanical System
100%
Crack Initiation
100%
Thin Films
75%
Si Wafer
50%
Sio2 Layer
50%
Layer Thickness
25%
Device Performance
25%
Si Substrate
25%
Initiation of Crack
25%
Structural Integrity
25%
Weibull Modulus
25%
Linear Elastic Fracture Mechanic
25%
Bending Tests
25%
Material Science
Piezoelectricity
100%
Microelectromechanical System
100%
Crack Initiation
100%
Crack Propagation
100%
Film
75%
Thin Films
75%
Fracture Mechanics
50%
Film Thickness
25%
Linear Elastic Fracture
25%