Thin film capacitors embedded into high density printed circuit boards

Angus I. Kingon; Taeyun Kim; Paula Vilarinho; Jon Paul Maria; Robert T. Crosswell

Thin film capacitors embedded into high density printed circuit boards

Angus I. Kingon, Taeyun Kim, Paula Vilarinho, Jon Paul Maria, Robert T. Crosswell

Materials Science and Engineering

Research output: Contribution to journal › Conference article › peer-review

Abstract

This paper describes an approach for embedding high value, thin film capacitors into high density multilayer printed circuit boards. Pb_0.85La_0.15(Zr_0.52Ti_0.48)_0.96O₃ thin films are prepared by chemical solution deposition on 50 μm Ni-coated Cu foils. Capacitance density and loss tangent values range between 300 and 400 nF/cm² and 0.01 and 0.02 from 1 to 1000 kHz respectively. Integration of these foils into a standard HDI process. The capacitance densities represent a 2 to 3 order of magnitude improvement over currently available embedded capacitor technologies for polymeric packages.

Original language	English (US)
Pages (from-to)	448-451
Number of pages	4
Journal	Proceedings of SPIE - The International Society for Optical Engineering
Volume	4587
State	Published - 2001
Event	2001 International Symposium on Microelectronics - Baltimore, MD, United States Duration: Oct 9 2001 → Oct 11 2001

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Computer Science Applications
Applied Mathematics
Electrical and Electronic Engineering

Cite this

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title = "Thin film capacitors embedded into high density printed circuit boards",

abstract = "This paper describes an approach for embedding high value, thin film capacitors into high density multilayer printed circuit boards. Pb0.85La0.15(Zr0.52Ti0.48)0.96 O3 thin films are prepared by chemical solution deposition on 50 μm Ni-coated Cu foils. Capacitance density and loss tangent values range between 300 and 400 nF/cm2 and 0.01 and 0.02 from 1 to 1000 kHz respectively. Integration of these foils into a standard HDI process. The capacitance densities represent a 2 to 3 order of magnitude improvement over currently available embedded capacitor technologies for polymeric packages.",

author = "Kingon, {Angus I.} and Taeyun Kim and Paula Vilarinho and Maria, {Jon Paul} and Crosswell, {Robert T.}",

year = "2001",

language = "English (US)",

volume = "4587",

pages = "448--451",

journal = "Proceedings of SPIE - The International Society for Optical Engineering",

issn = "0277-786X",

publisher = "SPIE",

note = "2001 International Symposium on Microelectronics ; Conference date: 09-10-2001 Through 11-10-2001",

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TY - JOUR

T1 - Thin film capacitors embedded into high density printed circuit boards

AU - Kingon, Angus I.

AU - Kim, Taeyun

AU - Vilarinho, Paula

AU - Maria, Jon Paul

AU - Crosswell, Robert T.

PY - 2001

Y1 - 2001

N2 - This paper describes an approach for embedding high value, thin film capacitors into high density multilayer printed circuit boards. Pb0.85La0.15(Zr0.52Ti0.48)0.96 O3 thin films are prepared by chemical solution deposition on 50 μm Ni-coated Cu foils. Capacitance density and loss tangent values range between 300 and 400 nF/cm2 and 0.01 and 0.02 from 1 to 1000 kHz respectively. Integration of these foils into a standard HDI process. The capacitance densities represent a 2 to 3 order of magnitude improvement over currently available embedded capacitor technologies for polymeric packages.

AB - This paper describes an approach for embedding high value, thin film capacitors into high density multilayer printed circuit boards. Pb0.85La0.15(Zr0.52Ti0.48)0.96 O3 thin films are prepared by chemical solution deposition on 50 μm Ni-coated Cu foils. Capacitance density and loss tangent values range between 300 and 400 nF/cm2 and 0.01 and 0.02 from 1 to 1000 kHz respectively. Integration of these foils into a standard HDI process. The capacitance densities represent a 2 to 3 order of magnitude improvement over currently available embedded capacitor technologies for polymeric packages.

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UR - http://www.scopus.com/inward/citedby.url?scp=0035768612&partnerID=8YFLogxK

M3 - Conference article

AN - SCOPUS:0035768612

SN - 0277-786X

VL - 4587

SP - 448

EP - 451

JO - Proceedings of SPIE - The International Society for Optical Engineering

JF - Proceedings of SPIE - The International Society for Optical Engineering

T2 - 2001 International Symposium on Microelectronics

Y2 - 9 October 2001 through 11 October 2001

ER -

Thin film capacitors embedded into high density printed circuit boards

Abstract

All Science Journal Classification (ASJC) codes

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