Thin film thermoelectric metal-organic framework with high seebeck coefficient and low thermal conductivity

Kristopher J. Erickson; François Léonard; Vitalie Stavila; Michael E. Foster; Catalin D. Spataru; Reese E. Jones; Brian M. Foley; Patrick E. Hopkins; Mark D. Allendorf; A. Alec Talin

doi:10.1002/adma.201501078

Thin film thermoelectric metal-organic framework with high seebeck coefficient and low thermal conductivity

Kristopher J. Erickson, François Léonard, Vitalie Stavila, Michael E. Foster, Catalin D. Spataru, Reese E. Jones, Brian M. Foley, Patrick E. Hopkins, Mark D. Allendorf, A. Alec Talin

Mechanical Engineering

Research output: Contribution to journal › Article › peer-review

245 Scopus citations

Abstract

A new thermoelectric material with high Seebeck coefficient and low thermal conductivity is demonstrated based on an electrically conducting metal-organic framework (MOF) using the guest@MOF concept. This demonstration opens a new avenue for the future development of thermoelectric materials.

Original language	English (US)
Pages (from-to)	3453-3459
Number of pages	7
Journal	Advanced Materials
Volume	27
Issue number	22
DOIs	https://doi.org/10.1002/adma.201501078
State	Published - Jun 1 2015

All Science Journal Classification (ASJC) codes

General Materials Science
Mechanics of Materials
Mechanical Engineering

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10.1002/adma.201501078

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title = "Thin film thermoelectric metal-organic framework with high seebeck coefficient and low thermal conductivity",

abstract = "A new thermoelectric material with high Seebeck coefficient and low thermal conductivity is demonstrated based on an electrically conducting metal-organic framework (MOF) using the guest@MOF concept. This demonstration opens a new avenue for the future development of thermoelectric materials.",

author = "Erickson, {Kristopher J.} and Fran{\c c}ois L{\'e}onard and Vitalie Stavila and Foster, {Michael E.} and Spataru, {Catalin D.} and Jones, {Reese E.} and Foley, {Brian M.} and Hopkins, {Patrick E.} and Allendorf, {Mark D.} and Talin, {A. Alec}",

note = "Publisher Copyright: {\textcopyright} 2015 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.",

year = "2015",

month = jun,

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doi = "10.1002/adma.201501078",

language = "English (US)",

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journal = "Advanced Materials",

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T1 - Thin film thermoelectric metal-organic framework with high seebeck coefficient and low thermal conductivity

AU - Erickson, Kristopher J.

AU - Léonard, François

AU - Stavila, Vitalie

AU - Foster, Michael E.

AU - Spataru, Catalin D.

AU - Jones, Reese E.

AU - Foley, Brian M.

AU - Hopkins, Patrick E.

AU - Allendorf, Mark D.

AU - Talin, A. Alec

PY - 2015/6/1

Y1 - 2015/6/1

N2 - A new thermoelectric material with high Seebeck coefficient and low thermal conductivity is demonstrated based on an electrically conducting metal-organic framework (MOF) using the guest@MOF concept. This demonstration opens a new avenue for the future development of thermoelectric materials.

AB - A new thermoelectric material with high Seebeck coefficient and low thermal conductivity is demonstrated based on an electrically conducting metal-organic framework (MOF) using the guest@MOF concept. This demonstration opens a new avenue for the future development of thermoelectric materials.

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DO - 10.1002/adma.201501078

M3 - Article

AN - SCOPUS:85027952189

SN - 0935-9648

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SP - 3453

EP - 3459

JO - Advanced Materials

JF - Advanced Materials

IS - 22

ER -

Thin film thermoelectric metal-organic framework with high seebeck coefficient and low thermal conductivity

Abstract

All Science Journal Classification (ASJC) codes

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