Thin film thermoelectric metal-organic framework with high seebeck coefficient and low thermal conductivity

Kristopher J. Erickson; François Léonard; Vitalie Stavila; Michael E. Foster; Catalin D. Spataru; Reese E. Jones; Brian M. Foley; Patrick E. Hopkins; Mark D. Allendorf; A. Alec Talin

doi:10.1002/adma.201501078

Thin film thermoelectric metal-organic framework with high seebeck coefficient and low thermal conductivity

Kristopher J. Erickson
, François Léonard
, Vitalie Stavila
, Michael E. Foster
, Catalin D. Spataru
, Reese E. Jones
, Brian M. Foley
, Patrick E. Hopkins
, Mark D. Allendorf
, A. Alec Talin

Mechanical Engineering

Research output: Contribution to journal › Article › peer-review

277 Scopus citations

Abstract

A new thermoelectric material with high Seebeck coefficient and low thermal conductivity is demonstrated based on an electrically conducting metal-organic framework (MOF) using the guest@MOF concept. This demonstration opens a new avenue for the future development of thermoelectric materials.

Original language	English (US)
Pages (from-to)	3453-3459
Number of pages	7
Journal	Advanced Materials
Volume	27
Issue number	22
DOIs	https://doi.org/10.1002/adma.201501078
State	Published - Jun 1 2015

All Science Journal Classification (ASJC) codes

General Materials Science
Mechanics of Materials
Mechanical Engineering

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10.1002/adma.201501078

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title = "Thin film thermoelectric metal-organic framework with high seebeck coefficient and low thermal conductivity",

abstract = "A new thermoelectric material with high Seebeck coefficient and low thermal conductivity is demonstrated based on an electrically conducting metal-organic framework (MOF) using the guest@MOF concept. This demonstration opens a new avenue for the future development of thermoelectric materials.",

author = "Erickson, \{Kristopher J.\} and Fran{\c c}ois L{\'e}onard and Vitalie Stavila and Foster, \{Michael E.\} and Spataru, \{Catalin D.\} and Jones, \{Reese E.\} and Foley, \{Brian M.\} and Hopkins, \{Patrick E.\} and Allendorf, \{Mark D.\} and Talin, \{A. Alec\}",

note = "Publisher Copyright: {\textcopyright} 2015 WILEY-VCH Verlag GmbH \& Co. KGaA, Weinheim.",

year = "2015",

month = jun,

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doi = "10.1002/adma.201501078",

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journal = "Advanced Materials",

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T1 - Thin film thermoelectric metal-organic framework with high seebeck coefficient and low thermal conductivity

AU - Erickson, Kristopher J.

AU - Léonard, François

AU - Stavila, Vitalie

AU - Foster, Michael E.

AU - Spataru, Catalin D.

AU - Jones, Reese E.

AU - Foley, Brian M.

AU - Hopkins, Patrick E.

AU - Allendorf, Mark D.

AU - Talin, A. Alec

PY - 2015/6/1

Y1 - 2015/6/1

N2 - A new thermoelectric material with high Seebeck coefficient and low thermal conductivity is demonstrated based on an electrically conducting metal-organic framework (MOF) using the guest@MOF concept. This demonstration opens a new avenue for the future development of thermoelectric materials.

AB - A new thermoelectric material with high Seebeck coefficient and low thermal conductivity is demonstrated based on an electrically conducting metal-organic framework (MOF) using the guest@MOF concept. This demonstration opens a new avenue for the future development of thermoelectric materials.

UR - https://www.scopus.com/pages/publications/85027952189

UR - https://www.scopus.com/pages/publications/85027952189#tab=citedBy

U2 - 10.1002/adma.201501078

DO - 10.1002/adma.201501078

M3 - Article

AN - SCOPUS:85027952189

SN - 0935-9648

VL - 27

SP - 3453

EP - 3459

JO - Advanced Materials

JF - Advanced Materials

IS - 22

ER -

Thin film thermoelectric metal-organic framework with high seebeck coefficient and low thermal conductivity

Abstract

All Science Journal Classification (ASJC) codes

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