Titanium dioxide nanowire sensor array integration on CMOS platform using deterministic assembly

Oren Z. Gall, Xiahua Zhong, Daniel S. Schulman, Myungkoo Kang, Ali Razavieh, Theresa S. Mayer

Research output: Contribution to journalArticlepeer-review

3 Scopus citations

Abstract

Nanosensor arrays have recently received significant attention due to their utility in a wide range of applications, including gas sensing, fuel cells, internet of things, and portable health monitoring systems. Less attention has been given to the production of sensor platforms in the μW range for ultra-low power applications. Here, we discuss how to scale the nanosensor energy demand by developing a process for integration of nanowire sensing arrays on a monolithic CMOS chip. This work demonstrates an off-chip nanowire fabrication method; subsequently nanowires link to a fused SiO2 substrate using electric-field assisted directed assembly. The nanowire resistances shown in this work have the highest resistance uniformity reported to date of 18%, which enables a practical roadmap towards the coupling of nanosensors to CMOS circuits and signal processing systems. The article also presents the utility of optimizing annealing conditions of the off-chip metal-oxides prior to CMOS integration to avoid limitations of thermal budget and process incompatibility. In the context of the platform demonstrated here, directed assembly is a powerful tool that can realize highly uniform, cross-reactive arrays of different types of metal-oxide nanosensors suited for gas discrimination and signal processing systems.

Original languageEnglish (US)
Article number265501
JournalNanotechnology
Volume28
Issue number26
DOIs
StatePublished - Jun 6 2017

All Science Journal Classification (ASJC) codes

  • Bioengineering
  • General Chemistry
  • General Materials Science
  • Mechanics of Materials
  • Mechanical Engineering
  • Electrical and Electronic Engineering

Fingerprint

Dive into the research topics of 'Titanium dioxide nanowire sensor array integration on CMOS platform using deterministic assembly'. Together they form a unique fingerprint.

Cite this