Tools for chip-package co-design

As operating frequencies and system density increased, this “over the wall” sequential design strategy no longer worked. Table 14.1 summarizes the issues that have become important over the TABLE 14.1 Summary of Some of the Main issues, Solutions and Open Challenges in Chip-Package Co-design last decade, along with the solutions available and challenges still open. e next two sections discuss this table in detail, rst looking at digital co-design and then mixed-signal co-design. e following section provides a brief overview of the most successful co-design tool to date, the IBIS macromodeling language before presenting the conclusions, and an annotated bibliography.