TY - GEN
T1 - Training Set Optimization with Uncertainty Quantification for Machine Learning Models of Electromagnetic Structures
AU - Guo, Yiliang
AU - Bhatti, Osama Waqar
AU - Swaminathan, Madhavan
N1 - Funding Information:
This work was supported by DARPA under the Warden program (Project Number GR00013386).
Publisher Copyright:
© 2022 IEEE.
PY - 2022
Y1 - 2022
N2 - Neural Networks surrogate modeling for EM simulations saves computational and design time. Introducing uncertainty estimates into deterministic prediction models provides insight into the reliability and confidence of the model. However, gathering training data to train models is a very time-consuming and resource-consuming task. In this paper, we introduce a method to harness useful insights from confidence bounds to reduce the training set size required to train a model with reasonable accuracy and latency. Using a high-speed differential via structure, we show that the training samples required are 35% less with a slight trade-off in accuracy using the proposed method.
AB - Neural Networks surrogate modeling for EM simulations saves computational and design time. Introducing uncertainty estimates into deterministic prediction models provides insight into the reliability and confidence of the model. However, gathering training data to train models is a very time-consuming and resource-consuming task. In this paper, we introduce a method to harness useful insights from confidence bounds to reduce the training set size required to train a model with reasonable accuracy and latency. Using a high-speed differential via structure, we show that the training samples required are 35% less with a slight trade-off in accuracy using the proposed method.
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U2 - 10.1109/EDAPS56906.2022.9994897
DO - 10.1109/EDAPS56906.2022.9994897
M3 - Conference contribution
AN - SCOPUS:85146146228
T3 - IEEE Electrical Design of Advanced Packaging and Systems Symposium
BT - 2022 IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2022
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2022 IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2022
Y2 - 12 December 2022 through 14 December 2022
ER -