@inproceedings{826035a7c4b445b9b4b890862002fa0e,
title = "TSV fault detection with large non-contact probes using capacitive coupling for 3-D IC applications",
abstract = "A non-contact TSV fault detection method is proposed using capacitive coupled probing. The proposed method detects TSV faults by eye-pattern diagrams of extracted EM-modeled transfer characteristics. The TSV and a capacitive coupling is modeled using full wave analysis. Because the measurement is conducted by moving one top probe without contact alignment, it can achieve the fast detection. Moreover, several TSVs can be covered at one measurement. From the experimental results, the fault existence and no. of faults can be detected with good resolutions.",
author = "Youngkyu Kim and Lee, {Seok Jae} and Ahn, {Jin Ho} and Yoon, {Won Sang} and Madhavan Swaminathan and Han, {Sang Min}",
note = "Publisher Copyright: {\textcopyright} 2015 IEEE.; IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015 ; Conference date: 14-12-2015 Through 16-12-2015",
year = "2016",
month = jan,
day = "14",
doi = "10.1109/EDAPS.2015.7383667",
language = "English (US)",
series = "2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "58--61",
booktitle = "2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015",
address = "United States",
}