TSV fault detection with large non-contact probes using capacitive coupling for 3-D IC applications

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Fingerprint

Dive into the research topics of 'TSV fault detection with large non-contact probes using capacitive coupling for 3-D IC applications'. Together they form a unique fingerprint.

Keyphrases

Computer Science

Engineering