TSV-free FinFET-based Monolithic 3D+-IC with computing-in-memory SRAM cell for intelligent IoT devices

Fu Kuo Hsueh, Hsiao Yun Chiu, Chang Hong Shen, Jia Min Shieh, Ying Tsan Tang, Chih Chao Yang, Hsiu Chih Chen, Wen Hsien Huang, Bo Yuan Chen, Kun Ming Chen, Guo Wei Huang, Wei Hao Chen, Kuo Hsiang Hsu, Srivatsa Rangachar Srinivasa, Nicholas Jao, Albert Lee, Hochul Lee, Vijaykrishnan Narayanan, Kang Lung Wang, Meng Fan ChangWen Kuan Yeh

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

20 Scopus citations

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Material Science

Engineering

Computer Science