TY - GEN
T1 - Two-/Multi-Photon Imaging for Characterization of Fine Line Features and Microvias in Advanced Packaging
AU - Kathaperumal, Mohan
AU - Nie, Bai
AU - Bhaskar, Pragna
AU - Blancher, Christopher
AU - Nimbalkar, Pratik
AU - Liu, Fuhan
AU - Swaminathan, Madhavan
N1 - Funding Information:
Acknowledgements This work was supported by the Industry Consortium at the Georgia Tech Packaging Research Center (PRC). The authors would like to thank Dr. Andrew Shah for his help and support.
Publisher Copyright:
© 2022 IEEE.
PY - 2022
Y1 - 2022
N2 - This paper demonstrates the application of non-destructive two-/multi-photon imaging for the characterization of high density interconnects including fine lines and spaces and small microvias (d10 μm diameter). Scaling of microvia critical dimensions (CDs) to approach the L/S which is required to achieve very high density interconnects is a major challenge in panel scale packaging. However, the characterization of fine lines and spaces as well as microvias become very challenging, of particular concern is the determination of the formation of microvias. In this paper we present two-photon imaging technique which uses femtosecond laser with a tunable wavelength in the range of 700-800 nm and has the ability to measure the feature sizes of not only the lines and spaces but also the microvias. Moreover, we illustrate the use of this technique to clearly recognize whether the microvias drilled are through-hole vias compared to the vias having left over residues. In the absence of two-photon excited fluorescence from the materials, one can continue to make use of three-photon and multi-photon imaging techniques for the characterization of vias and L/S.
AB - This paper demonstrates the application of non-destructive two-/multi-photon imaging for the characterization of high density interconnects including fine lines and spaces and small microvias (d10 μm diameter). Scaling of microvia critical dimensions (CDs) to approach the L/S which is required to achieve very high density interconnects is a major challenge in panel scale packaging. However, the characterization of fine lines and spaces as well as microvias become very challenging, of particular concern is the determination of the formation of microvias. In this paper we present two-photon imaging technique which uses femtosecond laser with a tunable wavelength in the range of 700-800 nm and has the ability to measure the feature sizes of not only the lines and spaces but also the microvias. Moreover, we illustrate the use of this technique to clearly recognize whether the microvias drilled are through-hole vias compared to the vias having left over residues. In the absence of two-photon excited fluorescence from the materials, one can continue to make use of three-photon and multi-photon imaging techniques for the characterization of vias and L/S.
UR - http://www.scopus.com/inward/record.url?scp=85134668222&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85134668222&partnerID=8YFLogxK
U2 - 10.1109/ECTC51906.2022.00264
DO - 10.1109/ECTC51906.2022.00264
M3 - Conference contribution
AN - SCOPUS:85134668222
T3 - Proceedings - Electronic Components and Technology Conference
SP - 1674
EP - 1679
BT - Proceedings - IEEE 72nd Electronic Components and Technology Conference, ECTC 2022
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 72nd IEEE Electronic Components and Technology Conference, ECTC 2022
Y2 - 31 May 2022 through 3 June 2022
ER -