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Ultra-high density board technology for sub-100 μm pitch nano-wafer level packaging
V. Sundaram, Fuhan Liu, A. O. Aggarwal, S. M. Hosseini, S. Mekala, G. E. White, R. R. Tummala, M. Swaminathan, Woopoung Kim, R. Madhavan, G. Lo, M. K. Iyer, K. Vaidyanathan, Ee Hua Wong, Ranjan Rajoo, C. T. Chong
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
2
Scopus
citations