Ultra-miniaturized and surface-mountable glass-based 3D IPAC packages for RF modules

Yoichiro Sato; Srikrishna Sitaraman; Vijay Sukumaran; Bruce Chou; Junki Min; Motoshi Ono; Choukri Karoui; Franck Dosseul; Christian Nopper; Madhavan Swaminathan; Venky Sundaram; Rao Tummala

doi:10.1109/ECTC.2013.6575795

Ultra-miniaturized and surface-mountable glass-based 3D IPAC packages for RF modules

Yoichiro Sato, Srikrishna Sitaraman, Vijay Sukumaran, Bruce Chou, Junki Min, Motoshi Ono, Choukri Karoui, Franck Dosseul, Christian Nopper, Madhavan Swaminathan, Venky Sundaram, Rao Tummala

Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

26 Scopus citations

Abstract

This paper demonstrates ultra-miniaturized RF passive components integrated on thin glass substrate with small Through Package Vias (TPVs) to realize 3D Integrated Passive and Actives Component (IPAC) concept. Miniaturizationis achieved through; a) ultra-thin glass, b) low-loss thin dielectrics and c) small TPVs. Inductors, capacitors and low pass filters functioning in the frequency range of 0.8 GHz to 5.4 GHz were modeled and fabricated between thin dielectric layers on 100μm thin glass, and then assembled on PCB through BGA interconnections. The simulated results corroborated well with measured results, providing guidelines for RF module fabrication.

Original language	English (US)
Title of host publication	2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013
Pages	1656-1661
Number of pages	6
DOIs	https://doi.org/10.1109/ECTC.2013.6575795
State	Published - 2013
Event	2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013 - Las Vegas, NV, United States Duration: May 28 2013 → May 31 2013

Publication series

Name	Proceedings - Electronic Components and Technology Conference
ISSN (Print)	0569-5503

Conference

Conference	2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013
Country/Territory	United States
City	Las Vegas, NV
Period	5/28/13 → 5/31/13

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Access to Document

10.1109/ECTC.2013.6575795

Cite this

Sato, Y., Sitaraman, S., Sukumaran, V., Chou, B., Min, J., Ono, M., Karoui, C., Dosseul, F., Nopper, C., Swaminathan, M., Sundaram, V., & Tummala, R. (2013). Ultra-miniaturized and surface-mountable glass-based 3D IPAC packages for RF modules. In 2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013 (pp. 1656-1661). Article 6575795 (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2013.6575795

@inproceedings{00184d439636492c9ac411bb518a813d,

title = "Ultra-miniaturized and surface-mountable glass-based 3D IPAC packages for RF modules",

abstract = "This paper demonstrates ultra-miniaturized RF passive components integrated on thin glass substrate with small Through Package Vias (TPVs) to realize 3D Integrated Passive and Actives Component (IPAC) concept. Miniaturizationis achieved through; a) ultra-thin glass, b) low-loss thin dielectrics and c) small TPVs. Inductors, capacitors and low pass filters functioning in the frequency range of 0.8 GHz to 5.4 GHz were modeled and fabricated between thin dielectric layers on 100μm thin glass, and then assembled on PCB through BGA interconnections. The simulated results corroborated well with measured results, providing guidelines for RF module fabrication.",

author = "Yoichiro Sato and Srikrishna Sitaraman and Vijay Sukumaran and Bruce Chou and Junki Min and Motoshi Ono and Choukri Karoui and Franck Dosseul and Christian Nopper and Madhavan Swaminathan and Venky Sundaram and Rao Tummala",

year = "2013",

doi = "10.1109/ECTC.2013.6575795",

language = "English (US)",

isbn = "9781479902330",

series = "Proceedings - Electronic Components and Technology Conference",

pages = "1656--1661",

booktitle = "2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013",

note = "2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013 ; Conference date: 28-05-2013 Through 31-05-2013",

}

Sato, Y, Sitaraman, S, Sukumaran, V, Chou, B, Min, J, Ono, M, Karoui, C, Dosseul, F, Nopper, C, Swaminathan, M, Sundaram, V & Tummala, R 2013, Ultra-miniaturized and surface-mountable glass-based 3D IPAC packages for RF modules. in 2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013., 6575795, Proceedings - Electronic Components and Technology Conference, pp. 1656-1661, 2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013, Las Vegas, NV, United States, 5/28/13. https://doi.org/10.1109/ECTC.2013.6575795

Ultra-miniaturized and surface-mountable glass-based 3D IPAC packages for RF modules. / Sato, Yoichiro; Sitaraman, Srikrishna; Sukumaran, Vijay et al.
2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013. 2013. p. 1656-1661 6575795 (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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T1 - Ultra-miniaturized and surface-mountable glass-based 3D IPAC packages for RF modules

AU - Sato, Yoichiro

AU - Sitaraman, Srikrishna

AU - Sukumaran, Vijay

AU - Chou, Bruce

AU - Min, Junki

AU - Ono, Motoshi

AU - Karoui, Choukri

AU - Dosseul, Franck

AU - Nopper, Christian

AU - Swaminathan, Madhavan

AU - Sundaram, Venky

AU - Tummala, Rao

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AB - This paper demonstrates ultra-miniaturized RF passive components integrated on thin glass substrate with small Through Package Vias (TPVs) to realize 3D Integrated Passive and Actives Component (IPAC) concept. Miniaturizationis achieved through; a) ultra-thin glass, b) low-loss thin dielectrics and c) small TPVs. Inductors, capacitors and low pass filters functioning in the frequency range of 0.8 GHz to 5.4 GHz were modeled and fabricated between thin dielectric layers on 100μm thin glass, and then assembled on PCB through BGA interconnections. The simulated results corroborated well with measured results, providing guidelines for RF module fabrication.

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Ultra-miniaturized and surface-mountable glass-based 3D IPAC packages for RF modules

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