Ultra-Miniaturized, High-Performance Filters on Alumina Ribbon Ceramic Substrates for 5G Small-Cell Applications

Nahid Aslani-Amoli, Fuhan Liu, Madhavan Swaminathan, Cheng Gang Zhuang, Nikolay Z. Zhelev, Seong Ho Seok, Cheolbok Kim

Research output: Contribution to journalArticlepeer-review

Abstract

This article demonstrates ultra-compact, highperformance filters with footprint smaller than 0.6020 0.1250, operating in 39-GHz frequency band, on ultra-thin alumina ribbon ceramic (ARC) substrate, a newly developed material technology at Corning Inc. Bandpass filters (BPFs) with three topologies, i.e.,edge-coupled, hairpin, and interdigital, together with quasi-lumped elliptical low-pass filters (LPFs) are designed on 80- m-thick ARC substrates and fabricated using a semi-additive patterning (SAP) process. Characterized from 14 to 50 GHz using a vector network analyzer (VNA), filters on ARC exhibit excellent model-to-hardware correlation and outstanding performance with respect to passband insertion loss (IL), return loss, selectivity, and out-of-band rejection. Moreover, they depict a very flat group delay within the passband with a maximum variation up to 0.058 ns. Showing an IL less than 1.43- and 0.95-dB at the cut-off frequency and mid-band frequency, respectively, LPFs and BPFs demonstrate a size reduction of up to 93% and 86%, respectively, compared to their counterparts on other substrates, while outperforming them as well. These highly miniaturized, integrated filters with high Q-factor are best-suited for RF front-end modules (FEMs) and mobile handsets in 5G and millimeter-wave (mm-wave) frequency ranges, indicating the potential of ARC for such applications.

Original languageEnglish (US)
Pages (from-to)437-444
Number of pages8
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
Volume14
Issue number3
DOIs
StatePublished - Mar 1 2024

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

Cite this