Abstract
This article demonstrates ultra-compact, highperformance filters with footprint smaller than 0.6020 0.1250, operating in 39-GHz frequency band, on ultra-thin alumina ribbon ceramic (ARC) substrate, a newly developed material technology at Corning Inc. Bandpass filters (BPFs) with three topologies, i.e.,edge-coupled, hairpin, and interdigital, together with quasi-lumped elliptical low-pass filters (LPFs) are designed on 80- m-thick ARC substrates and fabricated using a semi-additive patterning (SAP) process. Characterized from 14 to 50 GHz using a vector network analyzer (VNA), filters on ARC exhibit excellent model-to-hardware correlation and outstanding performance with respect to passband insertion loss (IL), return loss, selectivity, and out-of-band rejection. Moreover, they depict a very flat group delay within the passband with a maximum variation up to 0.058 ns. Showing an IL less than 1.43- and 0.95-dB at the cut-off frequency and mid-band frequency, respectively, LPFs and BPFs demonstrate a size reduction of up to 93% and 86%, respectively, compared to their counterparts on other substrates, while outperforming them as well. These highly miniaturized, integrated filters with high Q-factor are best-suited for RF front-end modules (FEMs) and mobile handsets in 5G and millimeter-wave (mm-wave) frequency ranges, indicating the potential of ARC for such applications.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 437-444 |
| Number of pages | 8 |
| Journal | IEEE Transactions on Components, Packaging and Manufacturing Technology |
| Volume | 14 |
| Issue number | 3 |
| DOIs | |
| State | Published - Mar 1 2024 |
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Industrial and Manufacturing Engineering
- Electrical and Electronic Engineering
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