TY - GEN
T1 - Ultra-thin, flexible electronics for measurements of tape-spring hinge behavior
AU - Yao, Yao
AU - Li, Guanghui
AU - Ning, Xin
N1 - Funding Information:
The authors gratefully acknowledge the financial support from the Penn State University and the Haythornthwaite Foundation Research Initiation Grant.
Publisher Copyright:
© 2021, American Institute of Aeronautics and Astronautics Inc, AIAA. All rights reserved.
PY - 2021
Y1 - 2021
N2 - As deployable structures are more commonly used in space exploration, new in-situ structural monitoring technologies for such structures beyond traditional approaches are needed. In this study, we provide design, fabrication, and materials of an ultra-thin, soft electronic skin, which serves as a sensor system for in-situ structure validation of a deployable tape-spring hinge. Both the dynamic release behavior and the quasi-static release behavior of the structure are measured and monitored by the fabricated devices. We are able to measure vibration frequency, surface orientation, and induced strain in the deformed region that can be used to reconstruct the folding and deployment behavior of the structure.
AB - As deployable structures are more commonly used in space exploration, new in-situ structural monitoring technologies for such structures beyond traditional approaches are needed. In this study, we provide design, fabrication, and materials of an ultra-thin, soft electronic skin, which serves as a sensor system for in-situ structure validation of a deployable tape-spring hinge. Both the dynamic release behavior and the quasi-static release behavior of the structure are measured and monitored by the fabricated devices. We are able to measure vibration frequency, surface orientation, and induced strain in the deformed region that can be used to reconstruct the folding and deployment behavior of the structure.
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U2 - 10.2514/6.2021-1607
DO - 10.2514/6.2021-1607
M3 - Conference contribution
AN - SCOPUS:85099906472
SN - 9781624106095
T3 - AIAA Scitech 2021 Forum
SP - 1
EP - 7
BT - AIAA Scitech 2021 Forum
PB - American Institute of Aeronautics and Astronautics Inc, AIAA
T2 - AIAA Science and Technology Forum and Exposition, AIAA SciTech Forum 2021
Y2 - 11 January 2021 through 15 January 2021
ER -