Ultralow-Loss Substrate-Integrated Waveguides in Alumina Ribbon Ceramic Substrates for 75-170 GHz Wireless Applications

Nahid Aslani-Amoli; Mutee ur Rehman; Lakshmi Narasimha Vijay Kumar; Arya Moradinia; Fuhan Liu; Madhavan Swaminathan; Cheng Gang Zhuang; Rajesh Vaddi; Seong Ho Seok; Cheolbok Kim

doi:10.1109/LMWT.2023.3304949

Ultralow-Loss Substrate-Integrated Waveguides in Alumina Ribbon Ceramic Substrates for 75-170 GHz Wireless Applications

Nahid Aslani-Amoli
, Mutee ur Rehman
, Lakshmi Narasimha Vijay Kumar
, Arya Moradinia
, Fuhan Liu
, Madhavan Swaminathan
, Cheng Gang Zhuang
, Rajesh Vaddi
, Seong Ho Seok
, Cheolbok Kim

Electrical Engineering

Research output: Contribution to journal › Article › peer-review

4 Scopus citations

Abstract

This letter reports, for the first time, the ultralow insertion loss (IL) of substrate-integrated waveguides (SIWs) in alumina ribbon ceramic (ARC) substrate, a newly developed material technology at Corning Inc., for millimeter-wave (mm-wave) packaging applications. Demonstrated on an 80- $\mu \text{m}$ -thick ARC substrate using a semi-additive patterning (SAP) process, SIWs are fed by broadband microstrip taper transitions and characterized based on conductor-backed coplanar waveguide (CBCPW)-to-microstrip transitions and microstrip feedlines in 75-110 GHz (W-band) and 110-170 GHz (D-band), respectively. Using two-tier calibration, the average measured IL of ARC-based SIWs in W- and D-bands is extracted to be 0.13 ± 0.02 and 0.155 ± 0.01 dB/mm, respectively, showing an excellent agreement with simulated and theoretical modeling results. According to comparisons, SIWs on ARC outperform those on other substrates in terms of IL over 75-170 GHz, exhibit excellent performance, and provide easier fabrication as compared to air-filled SIWs. These first results reveal the potential of ARC substrates for the development of ultrathin, high-performance passive components and modules based on SIW technology in mm-wave frequency ranges.

Original language	English (US)
Pages (from-to)	1415-1418
Number of pages	4
Journal	IEEE Microwave and Wireless Technology Letters
Volume	33
Issue number	10
DOIs	https://doi.org/10.1109/LMWT.2023.3304949
State	Published - Oct 1 2023

All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering
Condensed Matter Physics

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10.1109/LMWT.2023.3304949

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Aslani-Amoli, N., Rehman, M. U., Vijay Kumar, L. N., Moradinia, A., Liu, F., Swaminathan, M., Zhuang, C. G., Vaddi, R., Seok, S. H., & Kim, C. (2023). Ultralow-Loss Substrate-Integrated Waveguides in Alumina Ribbon Ceramic Substrates for 75-170 GHz Wireless Applications. IEEE Microwave and Wireless Technology Letters, 33(10), 1415-1418. https://doi.org/10.1109/LMWT.2023.3304949

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title = "Ultralow-Loss Substrate-Integrated Waveguides in Alumina Ribbon Ceramic Substrates for 75-170 GHz Wireless Applications",

abstract = "This letter reports, for the first time, the ultralow insertion loss (IL) of substrate-integrated waveguides (SIWs) in alumina ribbon ceramic (ARC) substrate, a newly developed material technology at Corning Inc., for millimeter-wave (mm-wave) packaging applications. Demonstrated on an 80- \$\textbackslash{}mu \textbackslash{}text\{m\}\$ -thick ARC substrate using a semi-additive patterning (SAP) process, SIWs are fed by broadband microstrip taper transitions and characterized based on conductor-backed coplanar waveguide (CBCPW)-to-microstrip transitions and microstrip feedlines in 75-110 GHz (W-band) and 110-170 GHz (D-band), respectively. Using two-tier calibration, the average measured IL of ARC-based SIWs in W- and D-bands is extracted to be 0.13 ± 0.02 and 0.155 ± 0.01 dB/mm, respectively, showing an excellent agreement with simulated and theoretical modeling results. According to comparisons, SIWs on ARC outperform those on other substrates in terms of IL over 75-170 GHz, exhibit excellent performance, and provide easier fabrication as compared to air-filled SIWs. These first results reveal the potential of ARC substrates for the development of ultrathin, high-performance passive components and modules based on SIW technology in mm-wave frequency ranges.",

author = "Nahid Aslani-Amoli and Rehman, \{Mutee ur\} and \{Vijay Kumar\}, \{Lakshmi Narasimha\} and Arya Moradinia and Fuhan Liu and Madhavan Swaminathan and Zhuang, \{Cheng Gang\} and Rajesh Vaddi and Seok, \{Seong Ho\} and Cheolbok Kim",

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Aslani-Amoli, N, Rehman, MU, Vijay Kumar, LN, Moradinia, A, Liu, F, Swaminathan, M, Zhuang, CG, Vaddi, R, Seok, SH & Kim, C 2023, 'Ultralow-Loss Substrate-Integrated Waveguides in Alumina Ribbon Ceramic Substrates for 75-170 GHz Wireless Applications', IEEE Microwave and Wireless Technology Letters, vol. 33, no. 10, pp. 1415-1418. https://doi.org/10.1109/LMWT.2023.3304949

TY - JOUR

T1 - Ultralow-Loss Substrate-Integrated Waveguides in Alumina Ribbon Ceramic Substrates for 75-170 GHz Wireless Applications

AU - Aslani-Amoli, Nahid

AU - Rehman, Mutee ur

AU - Vijay Kumar, Lakshmi Narasimha

AU - Moradinia, Arya

AU - Liu, Fuhan

AU - Swaminathan, Madhavan

AU - Zhuang, Cheng Gang

AU - Vaddi, Rajesh

AU - Seok, Seong Ho

AU - Kim, Cheolbok

PY - 2023/10/1

Y1 - 2023/10/1

N2 - This letter reports, for the first time, the ultralow insertion loss (IL) of substrate-integrated waveguides (SIWs) in alumina ribbon ceramic (ARC) substrate, a newly developed material technology at Corning Inc., for millimeter-wave (mm-wave) packaging applications. Demonstrated on an 80- $\mu \text{m}$ -thick ARC substrate using a semi-additive patterning (SAP) process, SIWs are fed by broadband microstrip taper transitions and characterized based on conductor-backed coplanar waveguide (CBCPW)-to-microstrip transitions and microstrip feedlines in 75-110 GHz (W-band) and 110-170 GHz (D-band), respectively. Using two-tier calibration, the average measured IL of ARC-based SIWs in W- and D-bands is extracted to be 0.13 ± 0.02 and 0.155 ± 0.01 dB/mm, respectively, showing an excellent agreement with simulated and theoretical modeling results. According to comparisons, SIWs on ARC outperform those on other substrates in terms of IL over 75-170 GHz, exhibit excellent performance, and provide easier fabrication as compared to air-filled SIWs. These first results reveal the potential of ARC substrates for the development of ultrathin, high-performance passive components and modules based on SIW technology in mm-wave frequency ranges.

AB - This letter reports, for the first time, the ultralow insertion loss (IL) of substrate-integrated waveguides (SIWs) in alumina ribbon ceramic (ARC) substrate, a newly developed material technology at Corning Inc., for millimeter-wave (mm-wave) packaging applications. Demonstrated on an 80- $\mu \text{m}$ -thick ARC substrate using a semi-additive patterning (SAP) process, SIWs are fed by broadband microstrip taper transitions and characterized based on conductor-backed coplanar waveguide (CBCPW)-to-microstrip transitions and microstrip feedlines in 75-110 GHz (W-band) and 110-170 GHz (D-band), respectively. Using two-tier calibration, the average measured IL of ARC-based SIWs in W- and D-bands is extracted to be 0.13 ± 0.02 and 0.155 ± 0.01 dB/mm, respectively, showing an excellent agreement with simulated and theoretical modeling results. According to comparisons, SIWs on ARC outperform those on other substrates in terms of IL over 75-170 GHz, exhibit excellent performance, and provide easier fabrication as compared to air-filled SIWs. These first results reveal the potential of ARC substrates for the development of ultrathin, high-performance passive components and modules based on SIW technology in mm-wave frequency ranges.

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UR - https://www.scopus.com/pages/publications/85181826254#tab=citedBy

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DO - 10.1109/LMWT.2023.3304949

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SP - 1415

EP - 1418

JO - IEEE Microwave and Wireless Technology Letters

JF - IEEE Microwave and Wireless Technology Letters

IS - 10

ER -

Ultralow-Loss Substrate-Integrated Waveguides in Alumina Ribbon Ceramic Substrates for 75-170 GHz Wireless Applications

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