Ultrasonic motors co-sintered with low temperature cofired ceramics (LTCC) for optical fiber alignment

Seung Ho Park, Amanda Baker, Clive A. Randall, Kenji Uchino, Richard Eitel

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Recent requirements for micro motors in popular applications such as cellular phones, digital cameras, laptop computers etc. have accelerated the need for simple and compact piezoelectric ultrasonic motor development. In addition, the sub-micron motion of ultrasonic motors makes them strong candidates for precise positioning applications. For example, optical fiber alignment, which is currently a major issue for the optoelectronics industry, is the target of this investigation. In this work, compact and precise bimorph structures with delta-shaped piezoelectric ultrasonic motors are fabricated with low temperature co-fired ceramics (LTCC). Based on a low temperature sinterable, high power piezoelectric composition, a 2-degrees of freedom ultrasonic motor was cofired a with commercial LTCC green tape system at 900 °C. To obtain 2-degrees of freedom motion after a cofiring process, two delta-shaped motors were sandwiched together with four input electrodes. The delta-shaped motor was driven by double phases (sine and cosine voltages) for the x, y and diagonal axis movement. Fabricated motor size was below 1 cm 2 and showed sub micron range motion in 2-dimensional space. This motor was integrated into an LTCC substrate to produce an optical fiber alignment package. Details of the structure, driving circuit and functionality will be discussed in this article.

Original languageEnglish (US)
Title of host publicationInternational Microelectronics and Packaging Society - 3rd IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2007
Pages295-298
Number of pages4
StatePublished - Dec 1 2007
Event3rd International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2007 - Denver, CO, United States
Duration: Apr 23 2007Apr 26 2007

Publication series

NameInternational Microelectronics and Packaging Society - 3rd IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2007

Other

Other3rd International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2007
Country/TerritoryUnited States
CityDenver, CO
Period4/23/074/26/07

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Ceramics and Composites

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