Ultrathin slices of ferroelectric domain-patterned lithium niobate by crystal ion slicing

David A. Scrymgeour, Venkat Gopalan, Tony E. Haynes, Miguel Levy

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations


We report the successful fabrication of 6 μm thick slices from a ferroelectric domain microengineered LiNbO3 wafer device using the crystal ion slicing technique. The device was created by micropatterning ferroelectric domains in a bulk 0.3 mm thick wafer of z-cut LiNbO3, followed by ion-implanting with 3.8 MeV He+ ions to a fluence 5 × 10+16 ions/cm2 to create a damage layer at a well defined depth from the surface. Etching away this damaged layer in dilute hydrofluoric acid results in a liftoff of the top slice in which the ferroelectric domain patterns are left intact. The influence of annealing conditions on liftoff time and depth of etch lines was studied. Helium-Neon laser light was successfully coupled into the device. Due to unintentional breakage of the polished input and output faces, the electro-optic scanning performance has not been characterized so far.

Original languageEnglish (US)
Title of host publicationWafer Bonding and Thinning Techniques for Materials Integration
PublisherMaterials Research Society
Number of pages6
ISBN (Print)1558996176, 9781558996175
StatePublished - 2001
Event2001 MRS Spring Meeting - San Franciso, CA, United States
Duration: Apr 16 2001Apr 20 2001

Publication series

NameMaterials Research Society Symposium Proceedings
ISSN (Print)0272-9172


Other2001 MRS Spring Meeting
Country/TerritoryUnited States
CitySan Franciso, CA

All Science Journal Classification (ASJC) codes

  • General Materials Science
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering


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