TY - GEN
T1 - Using data replication to reduce communication energy on chip multiprocessors
AU - Kandemir, M.
AU - Chen, G.
AU - Li, F.
AU - Demirkiran, I.
PY - 2005
Y1 - 2005
N2 - Chip multiprocessors are gaining popularity as they are very suitable for data-intensive embedded and high-end processing. In particular, array-intensive embedded image and video applications can benefit a lot from these architectures due to coarse-grain parallelization they offer. However, if not optimized, interprocessor communication can be a major energy consumer. Focusing on a distributed memory chip multiprocessor architecture and array-intensive embedded applications, this paper proposes a compiler-based communication minimization strategy based on data replication. The proposed scheme replicates shared data items across the memories of the processors in a controlled fashion (i.e., under a memory limit), with the goal of eliminating the otherwise necessary interprocessor communication.
AB - Chip multiprocessors are gaining popularity as they are very suitable for data-intensive embedded and high-end processing. In particular, array-intensive embedded image and video applications can benefit a lot from these architectures due to coarse-grain parallelization they offer. However, if not optimized, interprocessor communication can be a major energy consumer. Focusing on a distributed memory chip multiprocessor architecture and array-intensive embedded applications, this paper proposes a compiler-based communication minimization strategy based on data replication. The proposed scheme replicates shared data items across the memories of the processors in a controlled fashion (i.e., under a memory limit), with the goal of eliminating the otherwise necessary interprocessor communication.
UR - http://www.scopus.com/inward/record.url?scp=77956195523&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=77956195523&partnerID=8YFLogxK
U2 - 10.1145/1120725.1121013
DO - 10.1145/1120725.1121013
M3 - Conference contribution
AN - SCOPUS:77956195523
SN - 0780387368
SN - 9780780387362
T3 - Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC
SP - 769
EP - 772
BT - Proceedings of the 2005 Asia and South Pacific Design Automation Conference, ASP-DAC 2005
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2005 Asia and South Pacific Design Automation Conference, ASP-DAC 2005
Y2 - 18 January 2005 through 21 January 2005
ER -