TY - JOUR
T1 - Utilizing the Cold Sintering Process for Flexible–Printable Electroceramic Device Fabrication
AU - Baker, Amanda
AU - Guo, Hanzheng
AU - Guo, Jing
AU - Randall, Clive
N1 - Funding Information:
This material is based upon work supported by the National Science Foundation, as part of the Center for Dielectrics and Piezoelectrics under grant nos. IIP-1361571 and 1361503.
Publisher Copyright:
© 2016 The American Ceramic Society
PY - 2016
Y1 - 2016
N2 - Conventional thermal sintering of ceramics is generally accomplished at high temperatures in kilns or furnaces. We have recently developed a procedure where the sintering of a ceramic can take place at temperatures below 200°C, using aqueous solutions as transient solvents to control dissolution and precipitation and enable densification (i.e., sintering). We have named this approach as the “Cold Sintering Process” because of the drastic reduction in sintering temperature and time relative to the conventional thermal process. In this study, we fabricate basic monolithic capacitor array structures using a ceramic paste that is printed on nickel foils and polymer sheets, with silver electrodes. The sintered capacitors, using a dielectric Lithium Molybdenum Oxide ceramic, were then cold sintered and tested for capacitance, loss, and microstructural development. Simple structures demonstrate that this approach could provide a cost-effective strategy to print and densify different materials such as ceramics, polymers, and metals on the same substrate to obtain functional circuitry.
AB - Conventional thermal sintering of ceramics is generally accomplished at high temperatures in kilns or furnaces. We have recently developed a procedure where the sintering of a ceramic can take place at temperatures below 200°C, using aqueous solutions as transient solvents to control dissolution and precipitation and enable densification (i.e., sintering). We have named this approach as the “Cold Sintering Process” because of the drastic reduction in sintering temperature and time relative to the conventional thermal process. In this study, we fabricate basic monolithic capacitor array structures using a ceramic paste that is printed on nickel foils and polymer sheets, with silver electrodes. The sintered capacitors, using a dielectric Lithium Molybdenum Oxide ceramic, were then cold sintered and tested for capacitance, loss, and microstructural development. Simple structures demonstrate that this approach could provide a cost-effective strategy to print and densify different materials such as ceramics, polymers, and metals on the same substrate to obtain functional circuitry.
UR - http://www.scopus.com/inward/record.url?scp=84983673511&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84983673511&partnerID=8YFLogxK
U2 - 10.1111/jace.14467
DO - 10.1111/jace.14467
M3 - Article
AN - SCOPUS:84983673511
SN - 0002-7820
VL - 99
SP - 3202
EP - 3204
JO - Journal of the American Ceramic Society
JF - Journal of the American Ceramic Society
IS - 10
ER -