TY - GEN
T1 - Variation Tolerant and Energy-Efficient Charge Domain Compute-in-Memory Array with Binary and Multi-Level Cell Ferroelectric FET
AU - Duan, Jiahui
AU - Xu, Yixin
AU - Zhao, Zijian
AU - Lu, Anni
AU - Read, James
AU - Imani, Mohsen
AU - Kampfe, Thomas
AU - Niemier, Mike
AU - Gong, Xiao
AU - Yu, Shimeng
AU - Narayanan, Vijaykrishnan
AU - Ni, Kai
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - In this work, we present a variation-tolerant and energy-efficient charge-domain Ferroelectric FET (FeFET) based Compute-in-Memory (CiM) array design that is compatible with both binary and multi-level cell memory sensing. We demonstrate that: 1) by exploiting FeFET as a nonvolatile switch, its high ON/OFF ratio in the subthreshold region can suppress the error introduced by the inaccurate ON state conductance, thus realizing robust CiM operations, unlike the current-domain CiM design where the computation results is highly sensitive to the device conductance variation; 2) by leveraging a dense dynamic random access memory (DRAM)-like 1FeFET1C cell structure, the proposed design benefits from the existing high density DRAM establishment while also significantly relaxing the capacitor retention and transistor leakage requirement; 3) the charge-domain CiM supports both binary FeFET with minimum overhead and MLC FeFET with tolerable latency for MLC state sensing, whose efficacy is validated experimentally on both cell-level and array-level; 4) the proposed CiM shows much better device variation resilience than conventional current-domain CiM, and also improves inference accuracy. Macro-level evaluation results demonstrate significantly higher energy efficiency and area efficiency compared to prior CiM works.
AB - In this work, we present a variation-tolerant and energy-efficient charge-domain Ferroelectric FET (FeFET) based Compute-in-Memory (CiM) array design that is compatible with both binary and multi-level cell memory sensing. We demonstrate that: 1) by exploiting FeFET as a nonvolatile switch, its high ON/OFF ratio in the subthreshold region can suppress the error introduced by the inaccurate ON state conductance, thus realizing robust CiM operations, unlike the current-domain CiM design where the computation results is highly sensitive to the device conductance variation; 2) by leveraging a dense dynamic random access memory (DRAM)-like 1FeFET1C cell structure, the proposed design benefits from the existing high density DRAM establishment while also significantly relaxing the capacitor retention and transistor leakage requirement; 3) the charge-domain CiM supports both binary FeFET with minimum overhead and MLC FeFET with tolerable latency for MLC state sensing, whose efficacy is validated experimentally on both cell-level and array-level; 4) the proposed CiM shows much better device variation resilience than conventional current-domain CiM, and also improves inference accuracy. Macro-level evaluation results demonstrate significantly higher energy efficiency and area efficiency compared to prior CiM works.
UR - http://www.scopus.com/inward/record.url?scp=86000012184&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=86000012184&partnerID=8YFLogxK
U2 - 10.1109/IEDM50854.2024.10873305
DO - 10.1109/IEDM50854.2024.10873305
M3 - Conference contribution
AN - SCOPUS:86000012184
T3 - Technical Digest - International Electron Devices Meeting, IEDM
BT - 2024 IEEE International Electron Devices Meeting, IEDM 2024
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2024 IEEE International Electron Devices Meeting, IEDM 2024
Y2 - 7 December 2024 through 11 December 2024
ER -