Visualization of confined jet impingement with boiling using time-resolved stereo-PIV

Matthew J. Rau, Tianqi Guo, Pavlos P. Vlachos, Suresh V. Garimella

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Two-phase liquid-vapor flow field measurements of confined jet impingement with boiling are performed using time-resolved stereo particle image velocimetry (stereo-PIV). A single circular jet of water, impinges normally from a 3.75 mm-diameter orifice onto a submerged circular heat source at an orifice-to-target spacing of 4 jet diameters. The impinging jet outflow including the vapor generated at the heat source are confined between the jet orifice plate and the bottom test section wall. Fluorescent seeding particles (10 μm in diameter) and time-resolved PIV measurements (taken at a sampling rate of 750 Hz) allow for imaging of the instantaneous interactions between the liquid and vapor structures. Liquid-phase velocity vectors within the two-phase flow field (with high vapor fractions) are presented as a function of heat flux at jet Reynolds numbers of 5,000 and 15,000 and contrasted with single-phase flow. The time-resolved measurements are used to highlight the influence of the vapor phase on the liquid flow field. It is found that bubble formation effectively blocks the developing wall-jet flow on the heated surface. The resulting liquid flow field in the confinement gap is dominated by vapor motion rather than by the entrainment from the developing wall jet.

Original languageEnglish (US)
Title of host publicationAdvanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics
Subtitle of host publicationPackaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales
PublisherAmerican Society of Mechanical Engineers
ISBN (Electronic)9780791856895
DOIs
StatePublished - 2015
EventASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2015, collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels - San Francisco, United States
Duration: Jul 6 2015Jul 9 2015

Publication series

NameASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2015, collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels
Volume2

Other

OtherASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2015, collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels
Country/TerritoryUnited States
CitySan Francisco
Period7/6/157/9/15

All Science Journal Classification (ASJC) codes

  • Process Chemistry and Technology

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