VOID FORMATION IN ADHESIVE BONDS.

Thomas M. Donnellan, John G. Williams, Ronald E. Trabocco

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Original language	English (US)
Title of host publication	National SAMPE Technical Conference
Publisher	SAMPE
Pages	478-488
Number of pages	11
ISBN (Print)	0938994239
State	Published - Dec 1 1983

Name	National SAMPE Technical Conference
Volume	15
ISSN (Print)	0147-9601

All Science Journal Classification (ASJC) codes

@inproceedings{ad54b1a5fd9244f58d800f73442db623,

title = "VOID FORMATION IN ADHESIVE BONDS.",

author = "Donnellan, {Thomas M.} and Williams, {John G.} and Trabocco, {Ronald E.}",

year = "1983",

month = dec,

day = "1",

language = "English (US)",

isbn = "0938994239",

series = "National SAMPE Technical Conference",

publisher = "SAMPE",

pages = "478--488",

booktitle = "National SAMPE Technical Conference",

}

TY - GEN

T1 - VOID FORMATION IN ADHESIVE BONDS.

AU - Donnellan, Thomas M.

AU - Williams, John G.

AU - Trabocco, Ronald E.

PY - 1983/12/1

Y1 - 1983/12/1

UR - http://www.scopus.com/inward/record.url?scp=0020883636&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0020883636&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:0020883636

SN - 0938994239

T3 - National SAMPE Technical Conference

SP - 478

EP - 488

BT - National SAMPE Technical Conference

PB - SAMPE

ER -