TY - GEN
T1 - Volumetric Photoacoustic Imaging with Low-Cost and Easily Fabricated Planar Array Ultrasound Transducers
AU - Mitra, Mahaan
AU - Kumar, Akshay
AU - Khandare, Shubham
AU - Gaddale, Prameth
AU - Anandan, Yashoda
AU - Pedibhotla, Srian
AU - Roy, Kaustav
AU - Chen, Haoyang
AU - Pratap, Rudra
AU - Kothapalli, Sri Rajasekhar
N1 - Publisher Copyright:
© 2024 SPIE.
PY - 2024
Y1 - 2024
N2 - 2-D Ultrasound (US) Transducer (2D-UST) arrays facilitate scan-less volumetric photoacoustic imaging (3D-PAI), but are typically high-cost, involve laborious fabrication process, and permit limited scalability in design with respect to array parameters like element count, aperture size, center frequency (f!) and array pitch. In this work, we report a novel, 2-D matrix UST array fabricated on a printed circuit board (PCB) substrate (2D-PCB-UST array) at low-cost and without the need of advanced cleanroom fabrication technologies. Further, the 2D-PCB-UST array parameters can be easily modified with PCB design software. We demonstrate the scalability by fabricating two arrays, (i) an 8x8 array with 1.5 mm pitch and f! 40 MHz, and (ii) an 4x4 array with 1.2 mm pitch and f! 11 MHz. Initial characterization results demonstrate wideband PA receive sensitivity, characterized by the 6-dB fractional bandwidth for both low and high frequency UST arrays. Phantom imaging results demonstrate 3D-PAI capabilities despite low element count and sparse array geometry.
AB - 2-D Ultrasound (US) Transducer (2D-UST) arrays facilitate scan-less volumetric photoacoustic imaging (3D-PAI), but are typically high-cost, involve laborious fabrication process, and permit limited scalability in design with respect to array parameters like element count, aperture size, center frequency (f!) and array pitch. In this work, we report a novel, 2-D matrix UST array fabricated on a printed circuit board (PCB) substrate (2D-PCB-UST array) at low-cost and without the need of advanced cleanroom fabrication technologies. Further, the 2D-PCB-UST array parameters can be easily modified with PCB design software. We demonstrate the scalability by fabricating two arrays, (i) an 8x8 array with 1.5 mm pitch and f! 40 MHz, and (ii) an 4x4 array with 1.2 mm pitch and f! 11 MHz. Initial characterization results demonstrate wideband PA receive sensitivity, characterized by the 6-dB fractional bandwidth for both low and high frequency UST arrays. Phantom imaging results demonstrate 3D-PAI capabilities despite low element count and sparse array geometry.
UR - http://www.scopus.com/inward/record.url?scp=85194476816&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85194476816&partnerID=8YFLogxK
U2 - 10.1117/12.3001634
DO - 10.1117/12.3001634
M3 - Conference contribution
AN - SCOPUS:85194476816
T3 - Progress in Biomedical Optics and Imaging - Proceedings of SPIE
BT - Photons Plus Ultrasound
A2 - Oraevsky, Alexander A.
A2 - Wang, Lihong V.
PB - SPIE
T2 - Photons Plus Ultrasound: Imaging and Sensing 2024
Y2 - 28 January 2024 through 31 January 2024
ER -